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MC33GD3100EK - NXP

Description: Driver 15A 1-OUT High Side/Low Side Half Brdg Automotive 32-Pin SSOP Tube

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MC33GD3100EK - NXP - PCB symbol
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PCB Footprints
MC33GD3100EK - NXP PCB footprint - Small Outline Packages - Small Outline Packages - 32Ld soic
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MC33GD3100EK - NXP - 3D model - Small Outline Packages - 32Ld soic
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MC33GD3100EK Details

  • Manufacturer Part Number:

    MC33GD3100EK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-32

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2020-03-05

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e3

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP32,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.5 mm

MC33GD3100EK Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN12247, which includes guidelines for component placement, routing, and thermal management.
  • NXP provides a range of application notes and design guides that provide guidance on optimizing the performance of the MC33GD3100EK in various applications, including automotive, industrial, and consumer electronics.
  • The MC33GD3100EK has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinking, thermal interface materials, and airflow management.
  • Yes, the MC33GD3100EK is designed to operate in high-vibration environments, such as in automotive applications. However, it's essential to ensure that the device is properly mounted and secured to the PCB to prevent mechanical stress.
  • NXP provides a range of troubleshooting guides and application notes that provide guidance on identifying and resolving common issues with the MC33GD3100EK, including debugging tools and techniques.

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MC33GD3100EK Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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