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MC33HB2001EK - NXP

Description: NXP - MC33HB2001EK - Motor Driver/Controller, DC Brush, 5V to 28V, 28V/3A/2 Outputs, HSOP-32

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Symbol
MC33HB2001EK - NXP - PCB symbol
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PCB Footprints
MC33HB2001EK - NXP PCB footprint - Small Outline Packages - Small Outline Packages - 32LD SOIC
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3D Models
MC33HB2001EK - NXP - 3D model - Small Outline Packages - 32LD SOIC
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MC33HB2001EK Details

  • Manufacturer Part Number:

    MC33HB2001EK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Analog IC - Other Type:

    HALF BRIDGE BRUSH DC MOTOR CONTROLLER

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e3

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    16 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SOP32,.4,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.45 mm

  • Supply Voltage-Max (Vsup):

    28 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.5 mm

MC33HB2001EK Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN12247, which includes guidelines for component placement, routing, and thermal management.
  • To optimize thermal performance, ensure good thermal conduction between the device and the PCB, use thermal vias, and consider using a heat sink or thermal interface material. Refer to the thermal management section in the datasheet for more information.
  • To minimize EMI and ensure EMC compliance, follow proper PCB layout and routing guidelines, use shielding and filtering where necessary, and consider using a common-mode choke or ferrite bead on the output. Refer to the EMI and EMC section in the datasheet for more information.
  • Use a systematic approach to troubleshoot issues, starting with checking the power supply, input voltage, and output voltage. Use oscilloscopes and logic analyzers to debug the issue. Refer to the troubleshooting section in the datasheet for more information.
  • Ensure the device is operated within the recommended operating conditions, and follow proper safety precautions when handling the device, such as avoiding electrical shock and using proper ESD protection.

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MC33HB2001EK Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like MC33H, or try a keyword search, such as Motion Control Electronics

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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