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MC33PT2001AER2 - NXP

Description: Driver 12-OUT High and Low Side 64-Pin HLQFP EP T/R

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Symbol
MC33PT2001AER2 - NXP - PCB symbol
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PCB Footprints
MC33PT2001AER2 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1510-1
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3D Models
MC33PT2001AER2 - NXP - 3D model - Quad Flat Packages - SOT1510-1
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MC33PT2001AER2 Details

  • Manufacturer Part Number:

    MC33PT2001AER2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HLQFP-64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2019-05-14

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • High Side Driver:

    YES

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PQFP-G64

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    TQFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

MC33PT2001AER2 Frequently Asked Questions (FAQs)

  • A good PCB layout for the MC33PT2001AER2 involves placing the device near the power source, using a solid ground plane, and keeping the input and output traces short and wide to minimize inductance and resistance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To optimize the performance of the MC33PT2001AER2 in a high-temperature environment, ensure good thermal conductivity by using a heat sink or a thermal pad, and follow proper PCB layout guidelines. Also, consider using a thermally-enhanced package or a device with a higher temperature rating.
  • To minimize EMI and EMC issues with the MC33PT2001AER2, use a shielded enclosure, keep the device away from antennas and other EMI-sensitive components, and use EMI filters or common-mode chokes on the input and output lines. Also, ensure good PCB layout and grounding practices.
  • To troubleshoot issues with the MC33PT2001AER2, start by checking the input voltage, output voltage, and current. Verify that the device is properly soldered and that there are no shorts or opens on the PCB. Use an oscilloscope to check for voltage ripple, noise, or oscillations. Consult the datasheet and application notes for troubleshooting guides and FAQs.
  • The MC33PT2001AER2 is a high-reliability device with a MTBF (Mean Time Between Failures) of >10 million hours. It is manufactured using a robust and reliable process, and is qualified to automotive and industrial standards such as AEC-Q100 and IEC 60747. Refer to the datasheet and NXP's quality and reliability documents for more information.

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MC33PT2001AER2 Overview

Use the download button to access the MC33PT2001AER2 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MC33P, or try a keyword search, such as MOSFET Drivers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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