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MC34709VK - NXP

Description: Application Processors 3V to 4.5V 130-Pin MAP-BGA Tray Power Management IC, i.MX50/53, 10 Bit ADC, 6 buck, 8 LDO, MAPBGA 130

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Symbol
MC34709VK - NXP - PCB symbol
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PCB Footprints
MC34709VK - NXP PCB footprint - BGA - BGA - SOT1554-1
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3D Models
MC34709VK - NXP - 3D model - BGA - SOT1554-1
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MC34709VK Details

  • Manufacturer Part Number:

    MC34709VK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MAPBGA-130

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-PBGA-B130

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    15

  • Number of Functions:

    1

  • Number of Terminals:

    130

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA130,15X15,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.25 mm

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    8 mm

MC34709VK Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MC34709VK involves placing the device close to the battery, using a solid ground plane, and keeping the input and output capacitors close to the device. A 4-layer PCB is recommended, with the top layer for signals, the second layer for the power plane, the third layer for the ground plane, and the bottom layer for the signals.
  • To optimize the performance of the MC34709VK, ensure that the input voltage is within the recommended range, use a low-ESR output capacitor, and minimize the trace length and width to reduce parasitic inductance and resistance. Additionally, use a thermal pad and a heat sink to improve thermal performance.
  • The MC34709VK has a thermal pad that must be connected to a heat sink or a thermal plane on the PCB to dissipate heat. The device can operate up to 125°C, but the junction temperature should be kept below 115°C for optimal performance and reliability.
  • To troubleshoot issues with the MC34709VK, check the input voltage, output voltage, and current consumption. Verify that the device is properly connected and that the input and output capacitors are of the correct value and type. Use an oscilloscope to check for oscillations or noise on the output.
  • The MC34709VK is designed to meet EMI and EMC standards, but proper PCB layout and design are crucial to minimize electromagnetic interference. Use a shielded enclosure, keep the device away from antennas and other EMI-sensitive components, and use EMI filters or shielding on the input and output lines.

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MC34709VK Overview

Use the download button to access the MC34709VK schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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