A 4-layer PCB with a solid ground plane, separate power planes for VIN and VOUT, and a thermal relief pattern for the thermal pad is recommended. Keep sensitive analog traces away from the inductor and ensure good decoupling.
Choose an inductor with a high saturation current, low DCR, and a suitable inductance value (e.g., 1-2.2 μH). Consider the inductor's physical size, core material, and operating frequency (e.g., 2 MHz for the MC3479P).
Use a low-ESR, X5R or X7R ceramic capacitor with a value of 4.7-10 μF, depending on the input voltage and ripple requirements. Ensure the capacitor is rated for the input voltage and has a suitable temperature range.
Use a thermal pad or heat sink with a thermal conductivity of at least 1 W/m-K. Ensure good airflow, and consider using a thermal interface material (TIM) with a thermal conductivity of at least 5 W/m-K. Monitor the junction temperature (TJ) and adjust the design as needed.
Use a low-ESR, X5R or X7R ceramic capacitor with a value of 10-22 μF, depending on the output voltage and ripple requirements. Ensure the capacitor is rated for the output voltage and has a suitable temperature range.
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