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MC34PF1510A6EP - NXP

Description: Power Management Specialised - PMIC Power Management IC, 3 Buck Regs, 3 LDO Regs, 40 QFN

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PCB Footprints
MC34PF1510A6EP - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN 40
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3D Models
MC34PF1510A6EP - NXP  - 3D model - Quad Flat No-Lead - QFN 40
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MC34PF1510A6EP Details

  • Manufacturer Part Number:

    MC34PF1510A6EP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-40

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.2SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    7 V

  • Supply Voltage-Min (Vsup):

    3.8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    4

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    5 mm

MC34PF1510A6EP Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C.
  • Use a shielded enclosure, ensure proper grounding, and implement a common-mode choke or ferrite bead on the input lines. Follow the recommended layout and decoupling guidelines in the datasheet.
  • Use a combination of ceramic and electrolytic capacitors, and consider adding a pi-filter or LC filter stage. Ensure the output capacitor is rated for the maximum output current and voltage.
  • Choose an input capacitor with a high ripple current rating, low ESR, and a voltage rating that exceeds the maximum input voltage. X7R or X5R ceramic capacitors are recommended.

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MC34PF1510A6EP Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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