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MC35FS6500CAE - NXP

Description: Power Management Specialized - PMIC System Basis Chip, DCDC 0.8A Vcore CAN, Grade0, LQFP48EP

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Symbol
MC35FS6500CAE - NXP - PCB symbol
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PCB Footprints
MC35FS6500CAE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - MC35FS6500CAE
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MC35FS6500CAE - NXP - 3D model - Quad Flat Packages - MC35FS6500CAE
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MC35FS6500CAE Details

  • Manufacturer Part Number:

    MC35FS6500CAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PQFP-G48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    HQFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Surface Mount:

    YES

  • Technology:

    SMARTMOS

  • Telecom IC Type:

    CAN TRANSCEIVER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

MC35FS6500CAE Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the MC35FS6500CAE application note (AN11586). It's essential to follow the guidelines for component placement, routing, and grounding to ensure optimal performance, especially for high-frequency signals.
  • The MC35FS6500CAE has multiple operating modes, such as USB, UART, and SPI. Configuration is done through register settings, which are explained in the device's user manual (UM11585). Additionally, NXP provides example code and configuration files for different operating modes.
  • The MC35FS6500CAE has various power management options, including dynamic voltage scaling, clock gating, and power-down modes. These options can be controlled through register settings or using the device's built-in power management unit (PMU). Refer to the user manual for more information.
  • NXP provides a secure boot mechanism and firmware update process for the MC35FS6500CAE. This involves using the device's built-in security features, such as the Secure Boot Loader (SBL) and the Firmware Update Module (FUM). Refer to the security documentation (AN11587) and the user manual for implementation details.
  • The MC35FS6500CAE has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to follow proper thermal management practices, such as using thermal pads, heat sinks, and thermal interfaces. NXP provides thermal design guidelines in the device's package information document (PID).

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MC35FS6500CAE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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