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MC74ACT86DG - onsemi

Description: Obsolete - Triple 3-Input NAND Gate

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MC74ACT86DG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-14
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MC74ACT86DG - onsemi  - 3D model - Small Outline Packages - SOIC-14
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MC74ACT86DG Details

  • Manufacturer Part Number:

    MC74ACT86DG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-14 NB

  • Package Description:

    SOIC-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    751A-03

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Family:

    ACT

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    XOR GATE

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Inputs:

    2

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    10.5 ns

  • Propagation Delay (tpd):

    10.5 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MC74ACT86DG Frequently Asked Questions (FAQs)

  • The maximum frequency of operation for the MC74ACT86DG is typically around 100 MHz, but it can vary depending on the specific application and operating conditions.
  • To ensure signal integrity, use proper PCB layout techniques, such as using short signal traces, minimizing impedance mismatches, and using termination resistors as needed. Additionally, consider using a low-skew clock distribution network and minimizing clock jitter.
  • A simple POR circuit can be implemented using a resistor, capacitor, and diode. The capacitor should be connected between VCC and GND, and the resistor and diode should be connected in series between VCC and the reset pin. The values of the components will depend on the specific application and operating conditions.
  • To handle thermal management, ensure good airflow around the device, use a heat sink if necessary, and consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink. Additionally, follow proper PCB design guidelines to minimize thermal resistance.
  • The MC74ACT86DG has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials, handle devices by the body or pins, and avoid touching the pins or leads.

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MC74ACT86DG Overview

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Part Image TC74ACT86FN Toshiba America Electronic Components

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Part Image SN74ACT86DE4 Texas Instruments

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Part Image 74ACT86MT STMicroelectronics

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For a full list of alternate parts for MC74ACT86DG, check out Findchips.com