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MC74HC4851ADR2G-Q - onsemi

Description: In Compliance With the Requirements of JEDEC Standard No. 7A; Injection Current Cross-Coupling Less than 1mV/mA (See Figure 9); Pin Compatible to HC405X and MC1405XB Devices; Chip Complexity: 154 FETs or 36 Equivalent Gates; Power Supply Range (VCC - GND) = 2.0 to 6.0 V; Pb-Free Packages are Available*

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PCB Footprints
MC74HC4851ADR2G-Q - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−16 9.90x3.90x1.50 1.27P CASE 751B ISSUE L
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3D Models
MC74HC4851ADR2G-Q - onsemi  - 3D model - Small Outline Packages - SOIC−16 9.90x3.90x1.50 1.27P CASE 751B ISSUE L
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MC74HC4851ADR2G-Q Details

  • Manufacturer Part Number:

    MC74HC4851ADR2G-Q

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-16

  • Package Description:

    SOP-16

  • Manufacturer Package Code:

    751B-05

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • On-state Resistance Match-Nom:

    160 Ω

  • On-state Resistance-Max (Ron):

    1800 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    300 ns

  • Switch-on Time-Max:

    300 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

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MC74HC4851ADR2G-Q Overview

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