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MC74LCX158DTR2G - onsemi

Description: Near Zero Static Supply Current (10mA) Substantially Reduces System Power Requirements; LVCMOS Compatible; Designed for 2.3 to 3.6V VCC Operation; LVTTL Compatible; ESD Performance: Human Body Model >2000V; Machine Model >200V; 24mA Balanced Output Sink and Source Capability; Latchup Performance Exceeds 500mA; 5V Tolerant Inputs - Interface Capability With 5V TTL Logic; Pb-Free Packages are Available*

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MC74LCX158DTR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP−16 height 1.2
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MC74LCX158DTR2G - onsemi  - 3D model - Small Outline Packages - TSSOP−16 height 1.2
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MC74LCX158DTR2G Details

  • Manufacturer Part Number:

    MC74LCX158DTR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-16

  • Package Description:

    SO-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    948F-01

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    MULTIPLEXER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Inputs:

    2

  • Number of Outputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    6.5 ns

  • Propagation Delay (tpd):

    8.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

Trust Checks

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Manufacturer Collaborated
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System Verified
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Community Approved
Sponsored

MC74LCX158DTR2G Overview

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