MC74LVX50DTG - onsemi

MC74LVX50DTG Details

• Manufacturer Part Number:

  MC74LVX50DTG

• Brand Name:

  onsemi

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  TSSOP-14

• Package Description:

  TSSOP-14

• Pin Count:

  14

• Manufacturer Package Code:

  948G

• Country Of Origin:

  Mainland China, Malaysia

• HTS Code:

  8542.39.00.60

• Factory Lead Time:

  9 Weeks

• Manufacturer:

  onsemi

• YTEOL:

  5.85

• Family:

  LV/LV-A/LVX/H

• JESD-30 Code:

  R-PDSO-G14

• JESD-609 Code:

  e4

• Length:

  5 mm

• Load Capacitance (CL):

  50 pF

• Logic IC Type:

  BUFFER

• Max I(ol):

  0.004 A

• Moisture Sensitivity Level:

  1

• Number of Functions:

  6

• Number of Inputs:

  1

• Number of Terminals:

  14

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSSOP

• Package Equivalence Code:

  TSSOP14,.25

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

• Packing Method:

  RAIL

• Peak Reflow Temperature (Cel):

  260

• Prop. Delay@Nom-Sup:

  11.5 ns

• Propagation Delay (tpd):

  16 ns

• Qualification Status:

  Not Qualified

• Schmitt Trigger:

  NO

• Seated Height-Max:

  1.2 mm

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2 V

• Supply Voltage-Nom (Vsup):

  2.7 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Nickel/Palladium/Gold (Ni/Pd/Au)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  4.4 mm