MC9S08AC60MPUE - NXP

MC9S08AC60MPUE Details

• Manufacturer Part Number:

  MC9S08AC60MPUE

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Not Recommended

• Package Description:

  10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-026BCD, LQFP-64

• Country Of Origin:

  Mainland China, Malaysia

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  13 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  3

• Has ADC:

  YES

• Bit Size:

  8

• Boundary Scan:

  NO

• Clock Frequency-Max:

  16 MHz

• DAC Channels:

  NO

• DMA Channels:

  NO

• JESD-30 Code:

  S-PQFP-G64

• JESD-609 Code:

  e3

• Length:

  10 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  54

• Number of Terminals:

  64

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFQFP

• Package Equivalence Code:

  QFP64,.47SQ,20

• Package Shape:

  SQUARE

• Package Style:

  FLATPACK, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (bytes):

  2048

• ROM (words):

  63280

• ROM Programmability:

  FLASH

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  1.6 mm

• Speed:

  40 MHz

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  2.7 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  10 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER