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MC9S08SH32MTL - NXP

Description: MCU 8-bit S08 CISC 32KB Flash 3.3V/5V Automotive 28-Pin TSSOP Tube

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PCB Footprints
MC9S08SH32MTL - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP28, plastic, thin shrink small outline package; 28 terminals; 0.65 mm pitch; 4.4 mm x 9.7 mm x 0.95
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MC9S08SH32MTL - NXP  - 3D model - Small Outline Packages - TSSOP28, plastic, thin shrink small outline package; 28 terminals; 0.65 mm pitch; 4.4 mm x 9.7 mm x 0.95
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for MC9S08SH32MTL
  • Part Number MC9S08SH32MTL
  • Manufacturer NXP
  • Pin Count 28
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - TSSOP28, plastic, thin shrink small outline package; 28 terminals; 0.65 mm pitch; 4.4 mm x 9.7 mm x 0.95
  • Released Date Aug 5, 2021
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

MC9S08SH32MTL Details

  • Manufacturer Part Number:

    MC9S08SH32MTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TSSOP-28

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Has ADC:

    YES

  • Bit Size:

    8

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    24

  • Number of Terminals:

    28

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    1024

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Speed:

    40 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

MC9S08SH32MTL Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the MC9S08SH32MTL is 20 MHz, but it can be overclocked to 24 MHz with some limitations.
  • The internal clock source of the MC9S08SH32MTL can be configured using the SYNR and REFS registers. The SYNR register sets the clock source, and the REFS register sets the clock frequency.
  • The maximum amount of current that the MC9S08SH32MTL can source or sink on its I/O pins is 25 mA, but it's recommended to limit it to 10 mA to ensure reliable operation.
  • The ADC on the MC9S08SH32MTL can be used by configuring the ADCSC1 and ADCSC2 registers, and then using the ADC-read instruction to read the converted value.
  • The COP watchdog timer on the MC9S08SH32MTL is used to reset the microcontroller if it fails to respond within a certain time period, indicating a software or hardware fault.

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MC9S08SH32MTL Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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