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MC9S08SH4MTG - NXP

Description: 8-Bit HCS08 Central Processor Unit (CPU) • 40-MHz HCS08 CPU (central processor unit) • HC08 instruction set with added BGND instruction • Support for up to 32 interrupt/reset sources On-Chip Memory • FLASH read/program/erase over full operating voltage and temperature • Random-access memory (RAM) Power-Saving Modes • Two very low power stop modes • Reduced power wait mode • Very low power real time interrupt for use in run, wait, and stop

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MC9S08SH4MTG - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP16 (SOT403-3)
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MC9S08SH4MTG - NXP  - 3D model - Small Outline Packages - TSSOP16 (SOT403-3)
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MC9S08SH4MTG Details

  • Manufacturer Part Number:

    MC9S08SH4MTG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    0.65 MM PITCH, TSSOP-20

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • Has ADC:

    YES

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    5 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    14

  • Number of Terminals:

    16

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    256

  • ROM (words):

    4096

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    40 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

MC9S08SH4MTG Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be used with the internal oscillator is 20 MHz. However, it's recommended to use a crystal oscillator or an external clock source for more accurate and stable clocking.
  • To configure the ADC to convert analog signals from multiple channels, you need to use the ADC's scan mode. This involves setting the ADCSC1 register to select the desired channels, and then using the ADCSC2 register to control the scan sequence.
  • The COP watchdog timer is a safety feature that resets the microcontroller if it fails to periodically reset the COP timer. This ensures that the microcontroller is operating properly and prevents it from getting stuck in an infinite loop or other abnormal condition.
  • To use the SCI module, you need to configure the SCI control registers (SCIC1 and SCIC2) to set the baud rate, data bits, and stop bits. Then, use the SCI data register (SCID) to transmit and receive data.
  • The TPM module is a 16-bit timer that can be used for various applications such as generating PWM signals, measuring pulse widths, and counting events. To use the TPM module, you need to configure the TPM control registers (TPMCTL0 and TPMCTL1) to set the timer mode, clock source, and other parameters.

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MC9S08SH4MTG Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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