MC9S12C32MPBE25 footprint, schematic symbol and 3D model by NXP

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PCB Footprints

MC9S12C32MPBE25 - NXP PCB footprint - Other - Other - QFP65P1200X1200X170-52N

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Datasheet Download Datasheet
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Part Number MC9S12C32MPBE25
Manufacturer NXP
Pin Count 52
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - QFP65P1200X1200X170-52N
Released Date Jan 11, 2017
Last Modified Date Nov 15, 2024 1:35 PM UTC
Pinout / Pin List Click Here (Member Only)

MC9S12C32MPBE25 Details

Manufacturer Part Number:
MC9S12C32MPBE25
Rohs Code:
Yes
Part Life Cycle Code:
Not Recommended
Package Description:
LQFP-52
Country Of Origin:
Mainland China, Malaysia
ECCN Code:
EAR99
HTS Code:
8542.31.00.01
Factory Lead Time:
13 Weeks
Manufacturer:
NXP Semiconductors
YTEOL:
3
Has ADC:
YES
Address Bus Width:
16
Bit Size:
16
Clock Frequency-Max:
50 MHz
DAC Channels:
NO
DMA Channels:
NO
External Data Bus Width:
16
JESD-30 Code:
S-PQFP-G52
JESD-609 Code:
e3
Length:
10 mm
Moisture Sensitivity Level:
3
Number of I/O Lines:
35
Number of Terminals:
52
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
PWM Channels:
YES
Package Body Material:
PLASTIC/EPOXY
Package Code:
LQFP
Package Shape:
SQUARE
Package Style:
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel):
260
ROM Programmability:
FLASH
Seated Height-Max:
1.7 mm
Speed:
25 MHz
Supply Voltage-Max:
2.75 V
Supply Voltage-Min:
2.35 V
Supply Voltage-Nom:
2.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
40
Width:
10 mm
uPs/uCs/Peripheral ICs Type:
MICROCONTROLLER

MC9S12C32MPBE25 Frequently Asked Questions (FAQs)

The MC9S12C32MPBE25 can operate from -40°C to 125°C, but the maximum junction temperature is 150°C.
The clock settings can be configured using the Clock Generation Module (CGM) registers. The CGM module allows you to select the clock source, divide the clock frequency, and enable/disable the clock outputs. Refer to the MC9S12C32MPBE25 datasheet and the HCS12 Microcontrollers Reference Manual for more information.
The maximum frequency for the external crystal oscillator is 20 MHz. However, the recommended frequency range is 4-16 MHz for optimal performance.
The MC9S12C32MPBE25 has 32 KB of flash memory that can be programmed using the Flash Programming Module (FPM). The FPM allows you to read, write, and erase the flash memory. You can use the FPM registers to control the flash programming operations. Refer to the MC9S12C32MPBE25 datasheet and the HCS12 Microcontrollers Reference Manual for more information.
The maximum current consumption of the MC9S12C32MPBE25 depends on the operating frequency and the peripherals used. At 25 MHz, the maximum current consumption is approximately 25 mA. However, this value can vary depending on the specific application and usage.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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