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MC9S12C64MPBE - NXP

Description: 16-bit Microcontrollers - MCU 9S12C64 (KOI)

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MC9S12C64MPBE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1671-1
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MC9S12C64MPBE - NXP  - 3D model - Quad Flat Packages - SOT1671-1
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MC9S12C64MPBE Details

  • Manufacturer Part Number:

    MC9S12C64MPBE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    LQFP-52

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • Has ADC:

    YES

  • Address Bus Width:

    16

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    CPU12

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G52

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    35

  • Number of Terminals:

    52

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP52,.47SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    4096

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.7 mm

  • Speed:

    25 MHz

  • Supply Current-Max:

    45 mA

  • Supply Voltage-Max:

    2.75 V

  • Supply Voltage-Min:

    2.35 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

MC9S12C64MPBE Frequently Asked Questions (FAQs)

  • The MC9S12C64MPBE can operate from -40°C to 125°C, but the recommended operating temperature range is -40°C to 105°C.
  • The clock settings can be configured using the Clock Generation Module (CGM) registers. The CGM module allows you to select the clock source, divide the clock frequency, and enable/disable the clock outputs. Refer to the MC9S12C64MPBE reference manual for more information.
  • The maximum frequency for the external crystal oscillator is 20 MHz. However, the recommended frequency range is 4 MHz to 16 MHz.
  • The internal flash memory can be accessed using the Flash Memory Module (FMM) registers. The FMM module allows you to read, write, and erase the flash memory. You can also use the flash memory to store program code and data. Refer to the MC9S12C64MPBE reference manual for more information.
  • The maximum current consumption of the MC9S12C64MPBE is approximately 35 mA at 25°C, with all peripherals enabled and running at 25 MHz. However, the current consumption can vary depending on the specific application and operating conditions.

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MC9S12C64MPBE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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