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MCAC100N08Y-TP - MCC

Description: Power MOSFETS

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MCAC100N08Y-TP - MCC - PCB symbol
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PCB Footprints
MCAC100N08Y-TP - MCC PCB footprint - Other - Other - DFN5060_23
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3D Models
MCAC100N08Y-TP - MCC - 3D model - Other - DFN5060_23
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MCAC100N08Y-TP Details

  • Manufacturer Part Number:

    MCAC100N08Y-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN5060, 8 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    600 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.0045 Ω

  • FET Technology:

    SPLIT GATE TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    57 pF

  • JESD-30 Code:

    R-PDSO-F8

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    152 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

MCAC100N08Y-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MCAC100N08Y-TP can be found in the Micro Commercial Components' application note AN-103, which provides guidelines for PCB layout and land pattern design.
  • The MCAC100N08Y-TP has a thermal pad on the bottom side, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the thermal plane.
  • The MCAC100N08Y-TP has an operating temperature range of -55°C to 150°C, but the maximum junction temperature (TJ) should not exceed 150°C. The device should be derated for operation above 125°C to ensure reliability.
  • The MCAC100N08Y-TP is a commercial-grade device, but Micro Commercial Components offers a high-reliability version, the MCAC100N08Y-HT, which is designed for aerospace and high-reliability applications. The MCAC100N08Y-HT has additional screening and testing to ensure higher reliability and performance.
  • The MCAC100N08Y-TP should be soldered using a reflow soldering process with a peak temperature of 260°C. The device should be aligned properly on the PCB, and the solder joints should be inspected for quality and integrity.

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MCAC100N08Y-TP Overview

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