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- Part Number MCAC10H03A-TP
- Manufacturer MCC
- Pin Count 9
- Part Category MOSFET (N-Channel)
- Package Category Other
- Footprint Name Other - DFN5060_23
- Released Date Jan 12, 2024
- Last Modified Date May 17, 2024 4:34 PM UTC
- Pinout / Pin List Click Here (Member Only)
MCAC10H03A-TP Details
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Manufacturer Part Number:
MCAC10H03A-TP
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
DFN5060-8
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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Manufacturer:
Micro Commercial Components
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YTEOL:
5.3
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Avalanche Energy Rating (Eas):
507 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
MCAC10H03A-TP Frequently Asked Questions (FAQs)
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The recommended land pattern for MCAC10H03A-TP can be found in the IPC-7351 standard or in the manufacturer's application notes. It typically includes a rectangular pad with a size of 1.3mm x 0.8mm and a solder mask clearance of 0.1mm.
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The thermal pad of MCAC10H03A-TP should be connected to a copper plane on the PCB to ensure good thermal dissipation. A thermal via or a thermal pad connection to the ground plane is recommended. The thermal pad should not be soldered, and a non-conductive epoxy or thermal interface material can be used to attach it to the PCB.
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The maximum operating temperature range for MCAC10H03A-TP is -40°C to 125°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for an extended period.
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Yes, MCAC10H03A-TP is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101 and is manufactured using a robust process that ensures high reliability and low defect rates.
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To ensure the reliability of MCAC10H03A-TP in a humid or high-temperature environment, it is recommended to follow proper PCB design and assembly guidelines, use a conformal coating, and ensure good thermal management. Additionally, the device should be stored in a dry and cool environment, and handling should be done with proper ESD protection.
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MCAC10H03A-TP Overview
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