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MCAC150N03A-TP - MCC

Description: Power MOSFETS

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MCAC150N03A-TP - MCC PCB footprint - Other - Other - DFN5060_23
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MCAC150N03A-TP - MCC  - 3D model - Other - DFN5060_23
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MCAC150N03A-TP Details

  • Manufacturer Part Number:

    MCAC150N03A-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN5060-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    400 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    150 A

  • Drain-source On Resistance-Max:

    0.003 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    643 pF

  • JESD-30 Code:

    R-PDSO-F8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    75 W

  • Pulsed Drain Current-Max (IDM):

    300 A

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

MCAC150N03A-TP Frequently Asked Questions (FAQs)

  • The thermal resistance of the MCAC150N03A-TP is typically around 2.5°C/W (junction-to-ambient) and 1.5°C/W (junction-to-case). However, this value can vary depending on the specific application and PCB design.
  • Yes, the MCAC150N03A-TP is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • The recommended PCB footprint for the MCAC150N03A-TP is a standard TO-252 (DPAK) footprint with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • The MCAC150N03A-TP is rated for operation up to 150°C, making it suitable for use in high-temperature environments. However, the device's performance and reliability may degrade at temperatures above 125°C.
  • The MCAC150N03A-TP has an ESD rating of 2kV (Human Body Model) and 150V (Machine Model), making it suitable for use in applications where ESD protection is required.

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MCAC150N03A-TP Overview

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