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- Part Number MCAC25P10YHE3-TP
- Manufacturer MCC
- Pin Count 9
- Part Category MOSFET (P-Channel)
- Package Category Other
- Footprint Name Other - DFN5060_23
- Released Date May 12, 2023
- Last Modified Date May 17, 2024 4:34 PM UTC
- Pinout / Pin List Click Here (Member Only)
MCAC25P10YHE3-TP Details
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Manufacturer Part Number:
MCAC25P10YHE3-TP
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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Manufacturer:
Micro Commercial Components
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YTEOL:
5
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DS Breakdown Voltage-Min:
100 V
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Drain Current-Max (ID):
25 A
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Drain-source On Resistance-Max:
0.06 Ω
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Peak Reflow Temperature (Cel):
260
MCAC25P10YHE3-TP Frequently Asked Questions (FAQs)
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The recommended land pattern for the MCAC25P10YHE3-TP is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
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The MCAC25P10YHE3-TP has a thermal resistance of 35°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or thermal interface material, and provide adequate airflow around the component.
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The recommended soldering profile for the MCAC25P10YHE3-TP is a peak temperature of 240°C, with a dwell time of 30-60 seconds above 217°C. Ensure that the component is not exposed to temperatures above 260°C.
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To ensure reliability in high-vibration environments, ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method. Additionally, consider using a vibration-dampening material or potting compound to reduce the impact of vibrations.
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The MCAC25P10YHE3-TP has an ESD rating of 2kV human body model (HBM) and 150V machine model (MM). To ensure ESD protection, handle the component in an ESD-controlled environment, and use ESD-protective packaging and handling materials.
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MCAC25P10YHE3-TP Overview
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