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- Part Number MCAC38N10YHE3-TP
- Manufacturer MCC
- Pin Count 9
- Part Category MOSFET (N-Channel)
- Package Category Other
- Footprint Name Other - DFN5060_23
- Released Date May 12, 2023
- Last Modified Date May 17, 2024 4:34 PM UTC
- Pinout / Pin List Click Here (Member Only)
MCAC38N10YHE3-TP Details
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Manufacturer Part Number:
MCAC38N10YHE3-TP
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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Manufacturer:
Micro Commercial Components
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YTEOL:
6
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DS Breakdown Voltage-Min:
100 V
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Drain Current-Max (ID):
38 A
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Drain-source On Resistance-Max:
0.023 Ω
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Peak Reflow Temperature (Cel):
260
MCAC38N10YHE3-TP Frequently Asked Questions (FAQs)
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The recommended land pattern for the MCAC38N10YHE3-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It is essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal issues.
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The MCAC38N10YHE3-TP has a thermal pad that needs to be connected to a heat sink or a thermal plane on the PCB to dissipate heat efficiently. Ensure that the thermal pad is soldered to a copper plane on the PCB, and consider using thermal interface materials to improve heat transfer.
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The MCAC38N10YHE3-TP has an operating temperature range of -55°C to 150°C. However, the maximum operating temperature range may vary depending on the specific application and the power dissipation of the device.
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To ensure the reliability of the MCAC38N10YHE3-TP in high-reliability applications, follow the recommended storage and handling procedures, use a clean and controlled assembly environment, and implement a robust testing and inspection process to detect any defects or anomalies.
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The MCAC38N10YHE3-TP has built-in ESD protection, but it is still essential to follow proper ESD handling and storage procedures to prevent damage to the device. Use ESD-safe materials, grounding straps, and follow the recommended handling procedures to prevent ESD damage.
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MCAC38N10YHE3-TP Overview
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