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MCAC68N03Y-TP - MCC

Description: Power MOSFETS

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MCAC68N03Y-TP Details

  • Manufacturer Part Number:

    MCAC68N03Y-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN5060, 8 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.4

  • Avalanche Energy Rating (Eas):

    72 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    68 A

  • Drain-source On Resistance-Max:

    0.0124 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    39 pF

  • JESD-30 Code:

    R-PDSO-F8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    35 W

  • Pulsed Drain Current-Max (IDM):

    160 A

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

MCAC68N03Y-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2 oz copper thickness, and ensuring good thermal conduction to the surrounding copper areas.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow the recommended operating temperature range, use a heat sink if necessary, and ensure good airflow around the device.
  • The recommended soldering conditions for the MCAC68N03Y-TP are a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that follows the IPC J-STD-020 standard.
  • Yes, the MCAC68N03Y-TP is designed to withstand high-vibration environments, but it is recommended to follow the recommended mounting and soldering procedures to ensure reliable operation.
  • The recommended storage condition for the MCAC68N03Y-TP is to store it in a dry, cool place, away from direct sunlight, and in its original packaging or an anti-static bag.

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MCAC68N03Y-TP Overview

Use the download button to access the MCAC68N03Y-TP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like MCAC6, or try a keyword search, such as Power Field-Effect Transistors

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