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MCAC88N04YHE3-TP - MCC

Description: N-Channel MOSFET

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MCAC88N04YHE3-TP - MCC - PCB symbol
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MCAC88N04YHE3-TP - MCC PCB footprint - Other - Other - DFN5060_24
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MCAC88N04YHE3-TP - MCC - 3D model - Other - DFN5060_24
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MCAC88N04YHE3-TP Details

  • Manufacturer Part Number:

    MCAC88N04YHE3-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN5060, 8 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    56 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    88 A

  • Drain-source On Resistance-Max:

    10 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    21 pF

  • JESD-30 Code:

    R-PDSO-F8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    68 W

  • Pulsed Drain Current-Max (IDM):

    352 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

MCAC88N04YHE3-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MCAC88N04YHE3-TP can be found in the Micro Commercial Components' application note AN-113, which provides guidelines for PCB layout and land pattern design.
  • The MCAC88N04YHE3-TP has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the thermal plane.
  • The MCAC88N04YHE3-TP has an operating temperature range of -40°C to 125°C, but it's recommended to derate the device's power dissipation above 85°C to ensure reliable operation.
  • Yes, the MCAC88N04YHE3-TP is qualified to AEC-Q101, which makes it suitable for automotive and high-reliability applications. However, it's recommended to consult with Micro Commercial Components' sales team to discuss specific requirements and testing protocols.
  • The MCAC88N04YHE3-TP has a lead-free finish, and it's recommended to use a soldering process with a peak temperature of 260°C or less to prevent damage to the device. A soldering profile with a slow ramp-up and cool-down rate is also recommended to minimize thermal stress.

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MCAC88N04YHE3-TP Overview

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