Part Image

MCAC88N12A-TP - MCC

Description: Power MOSFETS

Download MCAC88N12A-TP Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
3D Models
MCAC88N12A-TP - MCC  - 3D model
click to zoom
Note! To download footprints and symbols, use the build and request forms below

Build

Launch Build Wizard
Build Wizard not available for this package category!

Request (48 hours)

MCAC88N12A-TP Details

  • Manufacturer Part Number:

    MCAC88N12A-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • DS Breakdown Voltage-Min:

    120 V

  • Drain Current-Max (ID):

    88 A

  • Drain-source On Resistance-Max:

    0.0096 Ω

  • Peak Reflow Temperature (Cel):

    260

  • Time@Peak Reflow Temperature-Max (s):

    10

MCAC88N12A-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2oz copper thickness, and ensuring good thermal conduction to the surrounding copper areas. A thermal via array can also be used to improve heat dissipation.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material, and ensure that the device is operated within its specified temperature range. Additionally, consider using a heat sink or thermal management system to keep the device temperature within safe limits.
  • The recommended soldering conditions for the MCAC88N12A-TP are a peak temperature of 260°C, a soldering time of 10-15 seconds, and a soldering iron temperature of 350-370°C. It is also essential to use a solder with a melting point above 217°C to ensure reliable joints.
  • To handle ESD protection during handling and assembly, it is recommended to use an ESD wrist strap or mat, handle the device by the body or pins, avoid touching the pins or leads, and use ESD-protected packaging and storage materials. Additionally, consider using an ESD protection device or circuitry in the final product design.
  • The recommended storage and handling conditions for the MCAC88N12A-TP include storing the device in its original packaging, avoiding exposure to moisture, dust, or extreme temperatures, and handling the device in a clean and dry environment. It is also essential to follow proper ESD protection procedures during storage and handling.

Trust Checks

No trust score is available for this model.
Trust Score Unavailable
Sponsored

MCAC88N12A-TP Overview

Use the download button to access the MCAC88N12A-TP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like MCAC8, or try a keyword search, such as Power Field-Effect Transistors

Parts related to MCAC88N12A-TP

Showing 0 results

Select Package Category

Package Categories

Datasheet PDF Preview