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MCB130N10YA-TP - MCC

Description: N-Channel 100 V 130A (Tc) 260W (Tc) Surface Mount D2PAK

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MCB130N10YA-TP - MCC - PCB symbol
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MCB130N10YA-TP - MCC PCB footprint - Other - Other - MCB130N10YA-TP
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3D Models
MCB130N10YA-TP - MCC - 3D model - Other - MCB130N10YA-TP
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MCB130N10YA-TP Details

  • Manufacturer Part Number:

    MCB130N10YA-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    130 A

  • JESD-609 Code:

    e3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Matte Tin (Sn)

  • Time@Peak Reflow Temperature-Max (s):

    10

MCB130N10YA-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the MCB130N10YA-TP is a standard SOT-223 package with a minimum pad size of 1.5mm x 1.5mm and a maximum pad size of 2.5mm x 2.5mm.
  • Yes, the MCB130N10YA-TP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at temperatures above 125°C.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes thermal stress on the device.
  • The MCB130N10YA-TP should be stored in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
  • The MCB130N10YA-TP is designed for low-frequency applications up to 100 kHz. While it may be possible to use it in high-frequency applications, the device's performance and reliability may degrade. Consult the manufacturer or a qualified engineer for guidance on high-frequency applications.

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MCB130N10YA-TP Overview

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