Part Image

MCB200N06YA-TP - MCC

Description: N-Channel 60 V 200A 260W (Tj) Surface Mount D2PAK

Download MCB200N06YA-TP Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
MCB200N06YA-TP - MCC PCB footprint - Other - Other - MCB200N06YA-TP
click to zoom
3D Models
MCB200N06YA-TP - MCC  - 3D model - Other - MCB200N06YA-TP
click to zoom

MCB200N06YA-TP Details

  • Manufacturer Part Number:

    MCB200N06YA-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    D2PAK-3/2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    640 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    200 A

  • Drain-source On Resistance-Max:

    0.0043 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    59 pF

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    260 W

  • Pulsed Drain Current-Max (IDM):

    680 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

MCB200N06YA-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for MCB200N06YA-TP is a standard SOT-223 package with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • Yes, MCB200N06YA-TP is rated for operation up to 150°C, but it's recommended to derate the power dissipation according to the temperature derating curve in the datasheet.
  • To ensure reliability, follow proper PCB design and layout guidelines, use a robust soldering process, and perform thorough testing and validation according to the application requirements.
  • Yes, MCB200N06YA-TP is compatible with lead-free soldering processes, but it's recommended to follow the manufacturer's recommended soldering profile and temperature guidelines.
  • The typical turn-on and turn-off time for MCB200N06YA-TP is around 10-20 ns, but this can vary depending on the specific application and circuit design.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

MCB200N06YA-TP Overview

Use the download button to access the MCB200N06YA-TP schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MCB20, or try a keyword search, such as Power Field-Effect Transistors

Parts related to MCB200N06YA-TP

Showing 0 results