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- Stock & Prices $ Price & Stock for MCG15P10YHE3-TP
- Part Number MCG15P10YHE3-TP
- Manufacturer MCC
- Pin Count 1
- Part Category Integrated Circuit
- Last Modified Date Apr 8, 2025 8:01 AM UTC
- Pinout / Pin List Click Here (Member Only)
MCG15P10YHE3-TP Details
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Manufacturer Part Number:
MCG15P10YHE3-TP
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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Manufacturer:
Micro Commercial Components
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YTEOL:
5
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DS Breakdown Voltage-Min:
100 V
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Drain Current-Max (ID):
15 A
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Drain-source On Resistance-Max:
0.12 Ω
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Packing Method:
TR
MCG15P10YHE3-TP Frequently Asked Questions (FAQs)
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The recommended land pattern for the MCG15P10YHE3-TP can be found in the Micro Commercial Components' application note AN-113, which provides guidelines for PCB layout and land pattern design.
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The MCG15P10YHE3-TP has a thermal pad on the bottom side, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal via array can also be used to improve heat dissipation. Additionally, the component should be placed in a way that allows for good airflow around it.
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The MCG15P10YHE3-TP has an operating temperature range of -40°C to +125°C, but it's recommended to derate the component's power handling capability at higher temperatures to ensure reliable operation.
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The MCG15P10YHE3-TP is designed to meet the vibration requirements of IEC 60068-2-6, but it's recommended to perform additional testing and validation to ensure the component's reliability in high-vibration environments.
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The MCG15P10YHE3-TP should be soldered using a reflow soldering process with a peak temperature of 260°C. The component should be aligned properly on the PCB, and the solder paste should be applied according to the manufacturer's recommendations.
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MCG15P10YHE3-TP Overview
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