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- Part Number MCG65N03-TP
- Manufacturer MCC
- Pin Count 9
- Part Category MOSFET (N-Channel)
- Package Category Other
- Footprint Name Other - DFN3333_23
- Released Date Jan 26, 2024
- Last Modified Date May 17, 2024 4:34 PM UTC
- Pinout / Pin List Click Here (Member Only)
MCG65N03-TP Details
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Manufacturer Part Number:
MCG65N03-TP
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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Manufacturer:
Micro Commercial Components
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YTEOL:
5
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DS Breakdown Voltage-Min:
30 V
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Drain Current-Max (ID):
65 A
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Drain-source On Resistance-Max:
0.004 Ω
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JESD-609 Code:
e3
MCG65N03-TP Frequently Asked Questions (FAQs)
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The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using multiple vias to dissipate heat to the other layers. A minimum of 2oz copper thickness is recommended.
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To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves, ensure good thermal design, and avoid exceeding the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal interface material to improve heat dissipation.
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The maximum safe operating area (SOA) for the MCG65N03-TP is not explicitly stated in the datasheet. However, it's recommended to follow the guidelines provided in the application note AN-11184, which provides SOA curves for similar devices. Additionally, consult with the manufacturer's support team for specific guidance.
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The MCG65N03-TP is a commercial-grade device, and its suitability for high-reliability or automotive applications depends on the specific requirements of the application. It's recommended to consult with the manufacturer's support team to determine if the device meets the necessary qualifications and to discuss any additional testing or validation that may be required.
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The MCG65N03-TP has an integrated ESD protection circuit, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices, such as TVS diodes, to protect the device from external ESD events.
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MCG65N03-TP Overview
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