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MCGWF60N04YHE3-TP - MCC

Description: Split Gate Trench MOSFET Technology Low Thermal Resistance

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PCB Footprints
MCGWF60N04YHE3-TP - MCC PCB footprint - Other - Other - DFN3333-8(SWF)
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MCGWF60N04YHE3-TP - MCC  - 3D model - Other - DFN3333-8(SWF)
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MCGWF60N04YHE3-TP Details

  • Manufacturer Part Number:

    MCGWF60N04YHE3-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN3333-8(SWF), 8 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    156 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    60 A

  • Drain-source On Resistance-Max:

    0.0039 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    165 pF

  • JESD-30 Code:

    S-PDSO-N8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    93 W

  • Pulsed Drain Current-Max (IDM):

    240 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

MCGWF60N04YHE3-TP Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for MCGWF60N04YHE3-TP is a 6-pin SOT-23 package with a minimum pad size of 0.8mm x 0.8mm and a maximum pad size of 1.2mm x 1.2mm, with a 0.5mm spacing between pads.
  • To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a heat sink or thermal interface material to reduce the junction temperature of the device.
  • The maximum safe operating area (SOA) for MCGWF60N04YHE3-TP is typically defined by the device's voltage and current ratings, and can be found in the datasheet. However, it is recommended to consult with the manufacturer or a qualified engineer to determine the specific SOA for a given application.
  • Yes, MCGWF60N04YHE3-TP can be used in a switching regulator application, but it is recommended to ensure that the device is operated within its safe operating area (SOA) and that the switching frequency is within the recommended range to avoid overheating and reduce electromagnetic interference (EMI).
  • To handle ESD protection for MCGWF60N04YHE3-TP, it is recommended to follow proper handling and storage procedures, use ESD-protective packaging and materials, and consider adding ESD protection devices such as TVS diodes or ESD arrays to the circuit design.

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MCGWF60N04YHE3-TP Overview

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