MCIMX257DJM4AR2 - NXP

MCIMX257DJM4AR2 Details

• Manufacturer Part Number:

  MCIMX257DJM4AR2

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400

• Country Of Origin:

  Mainland China, Malaysia

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  13 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  5

• Additional Feature:

  ALSO REQUIRES 3.3 V I/O SUPPLY

• JESD-30 Code:

  S-PBGA-B400

• JESD-609 Code:

  e1

• Length:

  17 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  400

• Operating Temperature-Max:

  70 °C

• Operating Temperature-Min:

  -20 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA400,20X20,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.6 mm

• Supply Voltage-Max:

  1.52 V

• Supply Voltage-Min:

  1.38 V

• Supply Voltage-Nom:

  1.45 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  OTHER

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  17 mm

• uPs/uCs/Peripheral ICs Type:

  SoC