MCIMX535DVV1C - NXP

MCIMX535DVV1C Details

• Manufacturer Part Number:

  MCIMX535DVV1C

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  TEPBGA-529

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• JESD-30 Code:

  S-PBGA-B529

• JESD-609 Code:

  e2

• Length:

  19 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  529

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -20 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA529,23X23,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.85 mm

• Supply Voltage-Max:

  1.4 V

• Supply Voltage-Min:

  1.2 V

• Supply Voltage-Nom:

  1.25 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  OTHER

• Terminal Finish:

  Tin/Silver (Sn/Ag)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  19 mm

• uPs/uCs/Peripheral ICs Type:

  SoC