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MCIMX6L2DVN10AB - NXP

Description: Processors - Application Specialized i.MX6 Megrez

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MCIMX6L2DVN10AB - NXP - PCB symbol
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PCB Footprints
MCIMX6L2DVN10AB - NXP PCB footprint - BGA - BGA - Case 2240 13x13 BGA
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3D Models
MCIMX6L2DVN10AB - NXP - 3D model - BGA - Case 2240 13x13 BGA
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MCIMX6L2DVN10AB Details

  • Manufacturer Part Number:

    MCIMX6L2DVN10AB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TFBGA-432

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • JESD-30 Code:

    S-PBGA-B432

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    432

  • Operating Temperature-Max:

    95 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA432,24X24,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    1.5 V

  • Supply Voltage-Min:

    1.375 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MCIMX6L2DVN10AB Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the VDD_HIGH first, followed by VDD_LOW, and then the core voltage (VDD_CORE). This ensures that the internal voltage regulators are powered up correctly.
  • The clock sources can be configured using the Clock Controller (CCM) module. The CCM module allows you to select the clock source, configure the clock frequency, and enable/disable clock outputs. Refer to the CCM chapter in the reference manual for more details.
  • The maximum operating temperature range for the MCIMX6L2DVN10AB is -40°C to 105°C. However, it's recommended to operate the device within the recommended temperature range of 0°C to 90°C for optimal performance and reliability.
  • Secure boot can be implemented using the Boot Mode Controller (BMC) and the High-Assurance Boot (HAB) module. The BMC selects the boot mode, and the HAB module verifies the authenticity of the boot loader and kernel images. Refer to the security chapter in the reference manual for more details.
  • The MCIMX6L2DVN10AB can address up to 2GB of RAM. However, the actual amount of RAM that can be used depends on the specific application and the memory configuration.

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MCIMX6L2DVN10AB Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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