MCIMX6L8DVN10ACR - NXP

MCIMX6L8DVN10ACR Details

• Manufacturer Part Number:

  MCIMX6L8DVN10ACR

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  TFBGA-432

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  13 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  5

• JESD-30 Code:

  S-PBGA-B432

• JESD-609 Code:

  e1

• Length:

  13 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  432

• Operating Temperature-Max:

  95 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA432,24X24,20

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  1.1 mm

• Supply Voltage-Max:

  1.5 V

• Supply Voltage-Min:

  1.375 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  13 mm

• uPs/uCs/Peripheral ICs Type:

  SoC