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MCIMX6S1AVM08AD - NXP

Description: ARM® Cortex®-A9 Microprocessor IC i.MX6S 1 Core, 32-Bit 800MHz 624-MAPBGA (21x21) ,1.8V ,-40°C ~ 125°C (TJ) ,624-LFBGA ,800 MHz

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MCIMX6S1AVM08AD - NXP - PCB symbol
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PCB Footprints
MCIMX6S1AVM08AD - NXP PCB footprint - BGA - BGA - SOT1529-1_2025-2
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3D Models
MCIMX6S1AVM08AD - NXP - 3D model - BGA - SOT1529-1_2025-2
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MCIMX6S1AVM08AD Details

  • Manufacturer Part Number:

    MCIMX6S1AVM08AD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MABGA-624

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    26 Weeks

  • Date Of Intro:

    2017-09-22

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • Additional Feature:

    24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

  • JESD-30 Code:

    S-PBGA-B624

  • JESD-609 Code:

    e1

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    624

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.5 V

  • Supply Voltage-Min:

    1.275 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MCIMX6S1AVM08AD Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to first power up the VDD_HIGH_IN (1.2V to 1.35V) and then power up the VDD_LOW_IN (1.35V to 3.3V) with a delay of at least 10ms between the two power rails.
  • The clock sources can be configured using the Clock Control Module (CCM) registers. The CCM registers allow you to select the clock source, configure the clock frequency, and enable or disable the clock outputs.
  • The maximum operating temperature range for the MCIMX6S1AVM08AD is -40°C to 105°C (industrial temperature range) and 0°C to 70°C (commercial temperature range).
  • Secure boot can be implemented using the High Assurance Boot (HAB) feature, which uses a combination of hardware and software mechanisms to ensure the authenticity and integrity of the boot process.
  • The maximum amount of RAM that can be used with the MCIMX6S1AVM08AD is 4GB, using a 32-bit wide DDR3L memory interface.

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MCIMX6S1AVM08AD Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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