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MCIMX6S5EVM10AB - NXP

Description: Microprocessors - MPU i.MX6 Solo rev 1.1

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MCIMX6S5EVM10AB - NXP - PCB symbol
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PCB Footprints
MCIMX6S5EVM10AB - NXP PCB footprint - BGA - BGA - SOT1529- 1
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3D Models
MCIMX6S5EVM10AB - NXP - 3D model - BGA - SOT1529- 1
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MCIMX6S5EVM10AB Details

  • Manufacturer Part Number:

    MCIMX6S5EVM10AB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    MABGA-624

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B624

  • JESD-609 Code:

    e1

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    624

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA624,25X25,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.5 V

  • Supply Voltage-Min:

    1.35 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MCIMX6S5EVM10AB Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to first apply the 1.8V power rail, followed by the 3.3V power rail, and then the 1.2V power rail. This sequence helps to ensure proper power-up of the device.
  • The clock settings can be configured using the Clock Control Module (CCM) registers. The CCM registers control the clock frequencies, clock sources, and clock dividers. Refer to the i.MX6Solo Applications Processor Reference Manual for more information.
  • The maximum operating temperature range for the MCIMX6S5EVM10AB is -40°C to 105°C. However, the device can be operated at temperatures above 105°C for short periods of time, but this may affect its reliability and lifespan.
  • Secure boot on the MCIMX6S5EVM10AB can be implemented using the High Assurance Boot (HAB) mechanism. HAB provides a secure boot process that ensures the authenticity and integrity of the boot loader and operating system. Refer to the i.MX6Solo Applications Processor Reference Manual for more information.
  • The MCIMX6S5EVM10AB can support up to 2GB of RAM. However, the actual amount of RAM that can be used depends on the specific application and the memory configuration.

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MCIMX6S5EVM10AB Overview

Use the download button to access the MCIMX6S5EVM10AB schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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