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MCIMX6S8DVM10AD - NXP

Description: Processors - Application Specialized i.MX 6S ROM Perf Enhan

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MCIMX6S8DVM10AD - NXP - PCB symbol
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PCB Footprints
MCIMX6S8DVM10AD - NXP PCB footprint - BGA - BGA - SOT1529 (LFBGA624)
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3D Models
MCIMX6S8DVM10AD - NXP - 3D model - BGA - SOT1529 (LFBGA624)
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MCIMX6S8DVM10AD Details

  • Manufacturer Part Number:

    MCIMX6S8DVM10AD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MABGA-624

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B624

  • JESD-609 Code:

    e1

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    624

  • Operating Temperature-Max:

    95 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA624,25X25,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.5 V

  • Supply Voltage-Min:

    1.35 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MCIMX6S8DVM10AD Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the VDD_HIGH first, followed by VDD_LOW, and then the core voltage (VDD_CORE). This ensures that the internal voltage regulators are properly enabled and the device boots up correctly.
  • The clock sources for the MCIMX6S8DVM10AD can be configured using the Clock Control Module (CCM). The CCM allows you to select from various clock sources, such as the external oscillator, PLL, or internal clock, and configure the clock frequencies and dividers.
  • The maximum operating temperature range for the MCIMX6S8DVM10AD is -40°C to 105°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • Secure boot on the MCIMX6S8DVM10AD can be implemented using the High-Assurance Boot (HAB) mechanism. HAB uses a combination of hardware and software mechanisms to ensure that the device boots only with authorized firmware and prevents unauthorized access to the device.
  • The MCIMX6S8DVM10AD has a maximum address space of 1 GB, but the actual amount of RAM that can be used depends on the specific configuration and memory mapping. Typically, up to 512 MB of RAM can be used with the device.

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MCIMX6S8DVM10AD Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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