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MCIMX6U1AVM10AD - NXP

Description: Processors - Application Specialized i.MX 6DL ROM Perf Enhan

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PCB Footprints
MCIMX6U1AVM10AD - NXP PCB footprint - BGA - BGA - 21 x 21, 0.8 mm BGA 624
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3D Models
MCIMX6U1AVM10AD - NXP  - 3D model - BGA - 21 x 21, 0.8 mm BGA 624
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MCIMX6U1AVM10AD Details

  • Manufacturer Part Number:

    MCIMX6U1AVM10AD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MABGA-624

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Date Of Intro:

    2017-09-22

  • Manufacturer:

    NXP Semiconductors

  • Additional Feature:

    24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

  • JESD-30 Code:

    S-PBGA-B624

  • JESD-609 Code:

    e1

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    624

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.5 V

  • Supply Voltage-Min:

    1.4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MCIMX6U1AVM10AD Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the MCIMX6U1AVM10AD is -40°C to 105°C. However, it's essential to note that the device can operate at a wider temperature range, but with reduced performance and reliability.
  • To optimize power consumption on the MCIMX6U1AVM10AD, you can use various techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS). Additionally, you can use the device's power management features, such as the Power Management Unit (PMU) and the Dynamic Voltage and Frequency Scaling (DVFS) module.
  • The maximum clock frequency supported by the MCIMX6U1AVM10AD is 528 MHz for the Cortex-A7 core and 264 MHz for the Cortex-M4 core. However, the actual clock frequency may vary depending on the specific use case and system design.
  • To implement secure boot on the MCIMX6U1AVM10AD, you can use the device's built-in security features, such as the Boot ROM and the Secure Boot mechanism. You can also use third-party secure boot solutions, such as those provided by NXP's partners. It's essential to follow NXP's guidelines and recommendations for secure boot implementation to ensure the integrity and security of your system.
  • The MCIMX6U1AVM10AD has 1 GB of DDR3 RAM and 128 KB of on-chip SRAM. The device also has 128 MB of on-chip flash memory and supports up to 64 GB of external flash memory.

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MCIMX6U1AVM10AD Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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