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MCIMX6U5EVM10AD - NXP

Description: The Arm Cortex-A9 MPCore complex includes: • General Interrupt Controller (GIC) with 128 interrupt support • Global Timer • Snoop Control Unit (SCU) • 512 KB unified I/D L2 cache: — Used by one core in i.MX 6Solo — Shared by two cores in i.MX 6DualLite • Two Master AXI bus interfaces output of L2 cache • Frequency of the core (including NEON and L1 cache), as per Table 8. • NEON MPE coprocessor — SIMD Media Processing Architecture — NEON register file with 32x64-bit general-purpose registers — N

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MCIMX6U5EVM10AD - NXP - PCB symbol
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MCIMX6U5EVM10AD - NXP PCB footprint - BGA - BGA - SOT1529-1
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MCIMX6U5EVM10AD - NXP - 3D model - BGA - SOT1529-1
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MCIMX6U5EVM10AD Details

  • Manufacturer Part Number:

    MCIMX6U5EVM10AD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MABGA-624

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B624

  • JESD-609 Code:

    e1

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    624

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA624,25X25,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.5 V

  • Supply Voltage-Min:

    1.35 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MCIMX6U5EVM10AD Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply power to the VDD_HIGH first, followed by VDD_LOW, and then the core voltage (VDD_CORE). This ensures that the internal voltage regulators are powered up in the correct order.
  • The clock settings can be configured using the Clock Control Module (CCM) registers. The CCM registers control the clock sources, dividers, and multiplexers. Refer to the MCIMX6U5EVM10AD reference manual for detailed information on clock configuration.
  • The maximum operating temperature range for the MCIMX6U5EVM10AD is -40°C to 105°C. However, it's recommended to operate the device within the recommended temperature range of 0°C to 90°C for optimal performance and reliability.
  • Secure boot on the MCIMX6U5EVM10AD can be implemented using the High-Assurance Boot (HAB) feature. HAB provides a secure boot mechanism that ensures the authenticity and integrity of the boot process. Refer to the MCIMX6U5EVM10AD reference manual and the HAB documentation for detailed implementation guidelines.
  • The MCIMX6U5EVM10AD can support up to 4GB of RAM. However, the actual amount of RAM that can be used depends on the specific configuration and application requirements.

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MCIMX6U5EVM10AD Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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