MCIMX6Y1DVK05AB footprint, schematic symbol and 3D model by NXP

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MCIMX6Y1DVK05AB - NXP PCB footprint - BGA - BGA - SOT1598-1

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Part Number MCIMX6Y1DVK05AB
Manufacturer NXP
Pin Count 272
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - SOT1598-1
Released Date Aug 4, 2026
Last Modified Date Aug 4, 2026 10:34 AM UTC
Pinout / Pin List Click Here (Member Only)

MCIMX6Y1DVK05AB Details

Manufacturer Part Number:
MCIMX6Y1DVK05AB
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
MAPBGA-272
Country Of Origin:
Mainland China
ECCN Code:
5A992.C
HTS Code:
8542.31.00.01
Manufacturer:
NXP Semiconductors
YTEOL:
9
JESD-30 Code:
S-PBGA-B272
JESD-609 Code:
e4
Length:
9 mm
Moisture Sensitivity Level:
3
Number of Terminals:
272
Operating Temperature-Max:
95 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
LFBGA
Package Equivalence Code:
BGA272,17X17,20
Package Shape:
SQUARE
Package Style:
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
1.23 mm
Supply Voltage-Max:
1.5 V
Supply Voltage-Min:
1.275 V
Surface Mount:
YES
Technology:
CMOS
Terminal Finish:
Nickel/Gold (Ni/Au)
Terminal Form:
BALL
Terminal Pitch:
0.5 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
40
Width:
9 mm
uPs/uCs/Peripheral ICs Type:
SoC

MCIMX6Y1DVK05AB Frequently Asked Questions (FAQs)

The recommended power-on sequence is to first apply the 1.2V to 1.35V core voltage (VDD_CORE), followed by the 2.5V to 3.3V I/O voltage (VDD_IO). This ensures proper device operation and prevents latch-up.
The clock sources can be configured using the Clock Control Module (CCM) registers. The CCM provides multiple clock sources, including the external crystal oscillator, internal oscillator, and PLLs. The clock configuration depends on the specific application requirements and can be done using the NXP-provided software development kits (SDKs) or by consulting the reference manual.
The maximum operating temperature range for the MCIMX6Y1DVK05AB is -40°C to 105°C. However, the device can be operated at a reduced frequency and voltage at higher temperatures to ensure reliable operation.
Secure boot can be implemented using the High-Assurance Boot (HAB) feature, which provides a secure boot mechanism. This involves generating a secure boot image, signing it with a private key, and storing the public key in the device's One-Time Programmable (OTP) fuses. The HAB feature verifies the boot image signature during boot-up to ensure authenticity and integrity.
The MCIMX6Y1DVK05AB has a 32-bit DDR3 interface that can support up to 2GB of RAM. However, the actual amount of RAM that can be used depends on the specific application requirements and the memory configuration.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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