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MCMR04X75R0FTL - Multicomp Pro

Description: MULTICOMP - MCMR04X75R0FTL - RES, CERAMIC, 75R, 1%, 0.0625W, 0402

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PCB Footprints
MCMR04X75R0FTL - Multicomp Pro PCB footprint - Resistor Chip - Resistor Chip - 0402
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MCMR04X75R0FTL - Multicomp Pro  - 3D model - Resistor Chip - 0402
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MCMR04X75R0FTL Details

  • Manufacturer Part Number:

    MCMR04X75R0FTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    13

  • Additional Feature:

    ANTI-SULFUR, LASER TRIMMABLE, RATED AC VOLTAGE (V): 50

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.35 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.0625 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    75 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn)

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

MCMR04X75R0FTL Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for MCMR04X75R0FTL is a rectangular pad with dimensions of 4.5mm x 2.5mm, with a 1.5mm x 1.5mm thermal pad in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) area around the thermal pad.
  • During PCB assembly, the thermal pad should be connected to a copper plane on the PCB to ensure good thermal dissipation. A via or a thermal relief pattern can be used to connect the thermal pad to the copper plane. It's essential to ensure that the thermal pad is not soldered, as it can compromise the component's thermal performance.
  • The maximum operating temperature range for MCMR04X75R0FTL is -55°C to +150°C. However, the component's performance and reliability may degrade if operated at the extreme ends of this range. It's recommended to operate the component within a temperature range of -40°C to +125°C for optimal performance.
  • MCMR04X75R0FTL is designed to withstand moderate vibration levels. However, if the application involves high-vibration environments, it's recommended to use additional mechanical support or mounting mechanisms to ensure the component's reliability and performance. Consult the manufacturer's guidelines or perform thorough testing to ensure the component's suitability in such environments.
  • To ensure the reliability of MCMR04X75R0FTL in high-humidity environments, it's recommended to use conformal coating or potting compounds to protect the component from moisture. Additionally, ensure that the PCB is designed with moisture-resistant materials and that the component is stored in a dry environment before assembly.

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MCMR04X75R0FTL Overview

Use the download button to access the MCMR04X75R0FTL schematic symbol, PCB footprint, and 3D model.
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Part Image CR-02FLF---75R Viking Tech Corp

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Part Image 232270677509 YAGEO Corporation

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For a full list of alternate parts for MCMR04X75R0FTL, check out Findchips.com