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MCP100-450HI/TO - Microchip

Description: Microchip MCP100-450HI/TO, Processor Supervisor 3 V, 3.3 V, 5 V, 3-Pin TO-92

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MCP100-450HI/TO - Microchip - PCB symbol
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PCB Footprints
MCP100-450HI/TO - Microchip PCB footprint - Other - Other - TO127P254X495-3
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3D Models
MCP100-450HI/TO - Microchip - 3D model - Other - TO127P254X495-3
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MCP100-450HI/TO Details

  • Manufacturer Part Number:

    MCP100-450HI/TO

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-92

  • Package Description:

    PLASTIC, TO-92, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-92-3

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-92

  • Package Equivalence Code:

    SIP3,.1,50

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Qualification Status:

    Not Qualified

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    4.25 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +4.38V

MCP100-450HI/TO Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power dissipation at high temperatures.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for input decoupling. The capacitor should be placed as close to the device's input pins as possible.
  • Use a shielded enclosure, keep the device and its associated components away from antennas and other EMI sources, and use a common-mode choke or ferrite bead on the input lines. Additionally, ensure that the PCB layout is designed to minimize loop areas and radiation.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for output decoupling. The capacitor should be placed as close to the device's output pins as possible.

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MCP100-450HI/TO Overview

Use the download button to access the MCP100-450HI/TO schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MCP10, or try a keyword search, such as Power Management Circuits

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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