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MCP100-475HI/TO - Microchip

Description: IC SUPERVISOR ACTIVE LOW

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PCB Footprints
MCP100-475HI/TO - Microchip PCB footprint - Other - Other - TO127P254X495-3
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3D Models
MCP100-475HI/TO - Microchip  - 3D model - Other - TO127P254X495-3
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MCP100-475HI/TO Details

  • Manufacturer Part Number:

    MCP100-475HI/TO

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-92

  • Package Description:

    PLASTIC, TO-92, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-92-3

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-92

  • Package Equivalence Code:

    SIP3,.1,50

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Qualification Status:

    Not Qualified

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    4.5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +4.63V

MCP100-475HI/TO Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal relief pattern can help to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to consider the device's thermal derating. Additionally, ensure that the device is operated within its specified temperature range, and that the PCB is designed to minimize thermal resistance.
  • The recommended soldering profiles for the MCP100-475HI/TO involve a peak temperature of 240°C to 245°C, with a dwell time of 30-60 seconds above 217°C. It's essential to follow the recommended soldering profile to prevent damage to the device.
  • To troubleshoot issues with the device's output voltage regulation, check the input voltage, output voltage, and output current. Verify that the device is properly configured, and that the output capacitor is of sufficient value and type. Also, check for any signs of overheating or excessive current draw.
  • Operating the device beyond its specified maximum ratings can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to operate the device within its specified ratings to ensure reliable operation and to prevent damage to the device.

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MCP100-475HI/TO Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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