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MCP101-475HI/TO - Microchip

Description: IC SUPERVISOR ACTIVE HI

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MCP101-475HI/TO - Microchip PCB footprint - Other - Other - TO127P254X495-3
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MCP101-475HI/TO - Microchip  - 3D model - Other - TO127P254X495-3
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MCP101-475HI/TO Details

  • Manufacturer Part Number:

    MCP101-475HI/TO

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-92

  • Package Description:

    PLASTIC, TO-92, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-92-3

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-92

  • Package Equivalence Code:

    SIP3,.1,50

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Qualification Status:

    Not Qualified

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    4.5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +4.63V

MCP101-475HI/TO Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the thermal pad is connected to a solid ground plane.
  • To ensure reliable operation over the full temperature range, ensure that the device is operated within the recommended voltage and current specifications. Also, ensure that the device is properly decoupled with capacitors, and that the PCB is designed to minimize thermal gradients and thermal stress.
  • The recommended soldering conditions for the MCP101-475HI/TO are: peak temperature of 260°C, time above 217°C of 30 seconds, and a total process time of 90 seconds. It is also recommended to use a soldering iron with a temperature range of 350°C to 400°C.
  • During storage and shipping, the device should be stored in a dry, cool place, away from direct sunlight and moisture. The device should be handled with anti-static precautions, and should not be exposed to mechanical stress or vibration.
  • To prevent electrostatic discharge (ESD) damage, handle the device with anti-static precautions, such as using an anti-static wrist strap or mat. Ensure that the device is stored in an anti-static bag or tube, and that the PCB is designed with ESD protection in mind.

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MCP101-475HI/TO Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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