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MCP102T-450E/TT - Microchip

Description: Microchip MCP102T-450E/TT, Voltage Supervisor 4.271 → 4.49 V, 3-Pin SOT-23B

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MCP102T-450E/TT - Microchip - PCB symbol
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PCB Footprints
MCP102T-450E/TT - Microchip PCB footprint - Other - Other - SOT95P237X112-3N
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MCP102T-450E/TT - Microchip - 3D model - Other - SOT95P237X112-3N
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MCP102T-450E/TT Details

  • Manufacturer Part Number:

    MCP102T-450E/TT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    29 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.02 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.38V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.3 mm

MCP102T-450E/TT Frequently Asked Questions (FAQs)

  • Microchip recommends a PCB layout with a solid ground plane and a thermal relief pattern under the device to ensure optimal thermal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal conduction between the device and the PCB, and consider using a heat sink if necessary.
  • Microchip recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for the input capacitor. The capacitor should be placed as close to the device's input pins as possible to minimize noise and ensure optimal performance.
  • To prevent EOS damage, ensure that the device is operated within its recommended operating conditions, including voltage, current, and power dissipation. Additionally, use proper PCB design and layout techniques, such as using TVS diodes and resistors to limit voltage transients, and ensure that the device is properly soldered and handled during assembly.
  • Microchip recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF for the output capacitor. The capacitor should be placed as close to the device's output pins as possible to minimize noise and ensure optimal performance.

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MCP102T-450E/TT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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