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MCP103T-475E/TT - Microchip

Description: Micropower Voltage Supervisors

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MCP103T-475E/TT - Microchip - PCB symbol
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PCB Footprints
MCP103T-475E/TT - Microchip PCB footprint - Other - Other - SOT95P237X112-3N
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MCP103T-475E/TT - Microchip - 3D model - Other - SOT95P237X112-3N
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MCP103T-475E/TT Details

  • Manufacturer Part Number:

    MCP103T-475E/TT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.02 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.63 V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.3 mm

MCP103T-475E/TT Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • Microchip recommends using a low-ESR ceramic capacitor with a value between 1uF to 10uF, depending on the specific application requirements. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
  • To troubleshoot issues with output voltage regulation, check the input voltage, output load, and feedback network. Ensure that the input voltage is within the recommended range, the output load is within the specified current limit, and the feedback network is properly connected and configured. Also, verify that the device is not overheating or experiencing thermal shutdown.
  • Microchip recommends using a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 20 seconds. Hand soldering is not recommended due to the device's small size and thermal sensitivity. Ensure that the PCB is designed with a suitable solder mask and that the soldering process is performed in a controlled environment.

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MCP103T-475E/TT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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