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MCP121T-300E/TT - Microchip

Description: 1uA Supervisor Open Drain Active Low

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MCP121T-300E/TT - Microchip - PCB symbol
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PCB Footprints
MCP121T-300E/TT - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - MCP121T-300E/TT
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MCP121T-300E/TT - Microchip - 3D model - SOT23 (3-Pin) - MCP121T-300E/TT
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MCP121T-300E/TT Details

  • Manufacturer Part Number:

    MCP121T-300E/TT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.02 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.93V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.3 mm

MCP121T-300E/TT Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP121T-300E/TT involves keeping the input and output traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliability in high-temperature applications, ensure that the device is operated within its recommended operating temperature range (-40°C to +125°C), use a heat sink if necessary, and follow proper PCB design and layout guidelines to minimize thermal resistance.
  • The MCP121T-300E/TT has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the MCP121T-300E/TT can be used in switching regulator applications. However, ensure that the device is operated within its recommended frequency range (up to 300 kHz) and that the output voltage is within the device's specified range (up to 12V).
  • To troubleshoot issues with the MCP121T-300E/TT, start by checking the power supply voltage, input and output voltages, and the device's operating frequency. Use an oscilloscope to check for noise, ringing, or other anomalies on the output. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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MCP121T-300E/TT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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