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MCP121T-315E/TT - Microchip

Description: 1uA Supervisor Open Drain Active Low

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MCP121T-315E/TT - Microchip - PCB symbol
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PCB Footprints
MCP121T-315E/TT - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - MCP121T-315E/TT
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MCP121T-315E/TT - Microchip - 3D model - SOT23 (3-Pin) - MCP121T-315E/TT
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MCP121T-315E/TT Details

  • Manufacturer Part Number:

    MCP121T-315E/TT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Mainland China, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.02 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3.08V

  • Width:

    1.3 mm

MCP121T-315E/TT Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its specified temperature range (-40°C to +125°C). Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Also, consider using a thermally conductive adhesive or thermal interface material to improve heat transfer.
  • The recommended soldering conditions for the MCP121T-315E/TT are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350°C. Ensure that the device is not exposed to temperatures above 260°C for more than 10 seconds.
  • To handle ESD protection for the MCP121T-315E/TT, ensure that the device is handled and stored in an ESD-protected environment. Use ESD-protective packaging, and handle the device by the body or pins, rather than the leads. Implement ESD protection circuits in the system design, such as TVS diodes or ESD protection arrays.
  • The recommended storage conditions for the MCP121T-315E/TT are: temperature range of -40°C to +125°C, humidity of 60% or less, and protection from direct sunlight and moisture. Store the device in its original packaging or an ESD-protective bag.

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MCP121T-315E/TT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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