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MCP1259-E/UN - Microchip

Description: Conv DC-DC 1.8V to 3.6V Step Up Single-Out 3.3V 0.1A Automotive 10-Pin MSOP Tube

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MCP1259-E/UN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 10-Lead Plastic Micro Small Outline Package (UN) (MSOP)-
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MCP1259-E/UN - Microchip  - 3D model - Small Outline Packages - 10-Lead Plastic Micro Small Outline Package (UN) (MSOP)-
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MCP1259-E/UN Details

  • Manufacturer Part Number:

    MCP1259-E/UN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP, TSSOP10,.19,20

  • Pin Count:

    10

  • Manufacturer Package Code:

    MSOP-10

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9.81

  • Analog IC - Other Type:

    SWITCHED CAPACITOR REGULATOR

  • Input Voltage-Max:

    3.6 V

  • Input Voltage-Min:

    1.8 V

  • Input Voltage-Nom:

    2 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.1 A

  • Output Voltage-Max:

    6.501 V

  • Output Voltage-Min:

    3.201 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    650 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP1259-E/UN Frequently Asked Questions (FAQs)

  • Microchip recommends following a star-grounding topology, keeping analog and digital grounds separate, and using a solid ground plane to minimize noise and EMI. Additionally, keep the input and output traces short and away from each other to reduce crosstalk.
  • To ensure accurate voltage measurement, use a high-impedance input source, keep the input voltage within the specified range, and use a low-noise, low-impedance reference voltage. Also, consider using a voltage divider or an attenuator to reduce the input voltage if it exceeds the maximum rating.
  • The maximum sampling rate of the MCP1259-E/UN depends on the clock frequency and the conversion mode. In normal mode, the maximum sampling rate is 200 ksps, while in turbo mode, it can reach up to 400 ksps. However, the actual sampling rate may be limited by the system's clock frequency and the conversion time.
  • The MCP1259-E/UN has built-in overvoltage protection up to 16V. However, if the input voltage exceeds 16V, additional external protection circuitry may be required. Consider using a voltage limiter or a clamp circuit to prevent damage to the device.
  • The MCP1259-E/UN has a built-in POR circuit that resets the device when the power supply voltage falls below a certain threshold (typically around 1.5V). The POR circuit ensures that the device starts up in a known state and prevents incorrect operation during power-up.

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MCP1259-E/UN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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