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MCP130-460DI/TO - Microchip

Description: Supervisor Open Drain or Open Collector 1 Channel TO-92-3

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MCP130-460DI/TO - Microchip PCB footprint - Other - Other - MCP130-460DI/TO-2
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MCP130-460DI/TO - Microchip  - 3D model - Other - MCP130-460DI/TO-2
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MCP130-460DI/TO Details

  • Manufacturer Part Number:

    MCP130-460DI/TO

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-92

  • Package Description:

    PLASTIC, TO-92, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-92-3

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    MNL RST:N;PW FL IO:N;PRG RST DLY:N;WD:N;WDO:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-92

  • Package Equivalence Code:

    SIP3,.1,50

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Qualification Status:

    Not Qualified

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +4.48V

MCP130-460DI/TO Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP130-460DI/TO should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliable operation over the full temperature range, it is essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, the device should be operated within its specified voltage and current ratings.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It is essential to ensure that the device operates within its specified temperature range to maintain reliability and performance.
  • The power dissipation of the MCP130-460DI/TO can be calculated using the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current. The calculated power dissipation should be within the device's specified power rating.
  • To minimize EMI and EMC issues, it is recommended to use a shielded enclosure, keep the device away from sensitive circuits, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, a good PCB layout with a solid ground plane and proper decoupling can help reduce EMI and EMC emissions.

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MCP130-460DI/TO Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image MCP130T-460DI/TO Microchip Technology Inc

Power Management Circuit, Fixed, +4.48V, CMOS