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MCP130-475FI/TO - Microchip

Description: IC SUPERV 5K PULL-UP LOW

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MCP130-475FI/TO - Microchip PCB footprint - Other - Other - TO127P254X495-3
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3D Models
MCP130-475FI/TO - Microchip  - 3D model - Other - TO127P254X495-3
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MCP130-475FI/TO Details

  • Manufacturer Part Number:

    MCP130-475FI/TO

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-92

  • Package Description:

    PLASTIC, TO-92, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-92-3

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    MNL RST:N;PW FL IO:N;PRG RST DLY:N;WD:N;WDO:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-92

  • Package Equivalence Code:

    SIP3,.1,50

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Qualification Status:

    Not Qualified

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +4.63V

MCP130-475FI/TO Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the device's datasheet, which includes guidelines for component placement, routing, and thermal management. Additionally, the Microchip website offers a PCB layout checklist and a thermal design guide to help ensure optimal performance.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, Microchip provides a thermal derating chart in the datasheet to help designers determine the maximum operating temperature for their specific application.
  • The MCP130-475FI/TO has built-in ESD protection, but it's still important to follow proper ESD handling and storage procedures to prevent damage. Microchip recommends using ESD-safe materials, handling devices by the body or pins, and storing devices in ESD-safe packaging.
  • Yes, the MCP130-475FI/TO is suitable for use in switching power supply applications. However, it's essential to ensure that the device is properly bypassed and decoupled to prevent noise and oscillations. Microchip provides application notes and design guidelines for using the MCP130-475FI/TO in switching power supply applications.
  • Microchip provides a troubleshooting guide in the datasheet, which covers common issues and their solutions. Additionally, designers can use Microchip's online resources, such as the Knowledge Base and the Microchip Forum, to find answers to common questions and get support from experienced engineers.

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MCP130-475FI/TO Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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